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Laboratory of Scientific Hardware Systems, Dept. of Precision Science and Technology
Graduate School of Engineering, Osaka University

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Atomic-scale image of hydrogenated amorphous Si (a-Si:H) surface (2.2x2.2 nm2).





Kenta Arima
Associate Professor

Department of Precision Science and Technology
Graduate School of Engineering
Osaka University
2-1, Yamadaoka
Suita, Osaka 565-0871, Japan

Phone&Fax: +81-6-6879-7274

Education
Ph. D. in Engineering (Osaka University, 2000)
"Observations of Si surfaces after industrial processes by scanning tunneling microscopy and spectroscopy"
Professional Experience
Junior Research Associate (The Institute of Physical and Chemical Research (RIKEN)) (1997-2000)
Visiting Scholar (Lawrence Berkeley National Laboratory) (2007-2008)
Assistant Professor (Osaka University) (2000-2009)
Associate Professor (Osaka University) (2009-)
Publications
Listed on a separate sheet .
Research Grantee
The Murata Science Foundation (2002).
Shimadzu Science Foundation (2004).
Osaka University supporters association (2004).
Nissan Science Foundation (2005).
Kansai Research Foundation for technology promotion (2006).
Yazaki Memorial Foundation for Science and Technology (2006).
The Mazda Foundation (2006).
Foundation of Promotion of Material Science and Technology of Japan (2007).
Inamori Foundation (2007).
Tokuyama Science Foundation (2007).
The Japan Securities Scholarship Foundation (2007).
Yamada Science Foundation (Support for Long Term Visit) (2007-2008).
Izumi Science and Technology Foundation (2009).
Ministry of Education, Culture, Sports, Science and Technology.
[Grant-in-Aid for the Encouragement of Young Scientists (2001-2002, 2003-2004, 2005-2006)]
[Grant-in-Aid for Scientific Research on Priority Areas (2007)]
Current Memberships
Materials Research Society
The Japan Society of Applied Physics
The Surface Science Society of Japan
The Japan Society for Precision Engineering (*)
(*) Session Organizer since 2002
Professional Qualification
Hazardous materials officers license [Class B, Group 4] (Japan Fire Engineering Qualification Center)
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Research Interests
I am interested in nanometer-scale measurements and evaluations of semiconductor surfaces after various industrial processes such as wet cleaning, global planarization processes, thin film growth and oxidation. I have been applying various surface analyses in order to fulfill the requirement from device fabrications and wafer manufacturing. I am familiar with scanning tunneling microscopy/spectroscopy(STM/STS), Fourier transform infrared spectrometry with attenuated total reflection arrangements(FTIR-ATR), low energy electron diffraction(LEED), thermal desorption spectroscopy(TDS) and inductively coupled plasma mass spectroscopy (ICP-MS).
Research Topics related to scanning tunneling microscopy
Atomic-scale analysis of Si surfaces after wet cleaning
For the fabrication of ultralarge scale integration devices in the next generation, it is absolutely necessary to understand the structure of Si surfaces on an atomic scale after wet cleaning. Especially, clarification of the atomic structure of the hydrogen-terminated Si(001) surface after diluted HF cleaning and subsequent rinsing with water is important.
We have succeeded in obtaining clear atomic images exhibiting ideal 1x1 dihydride patterns after dilute HF cleaning by scanning tunneling microscopy. In addition, we have revealed that the 1x1 dihydride structure disappears when the surface is subsequently rinsed with water, because every other dihydride row of the ideal 1x structure is preferentially etched in water.
A magnified STM image (3.5x3.5 nm2) after HF cleaning. An ideal 1x1 structure is clearly resolved.
A magnified STM image (3.5x3.5 nm2) after subsequent rinsing with water for 10 min. Every other dihydride row is missing. See J. Appl. Phys. vol. 91, pp. 4065 (2002).
STM image after HF cleaning (20x20 nm2). See Appl. Phys. Lett. vol. 76, pp. 463 (2000).
Recently, Si(110) attracts attentions as a substrate for CMOS circuits because it has been reported that the hole mobility of Si(110) is now higher than that of Si(001). It is well known that the interface roughness determines the carrier mobility of MOS transistors. In order to realize the higher performance of CMOS circuits on Si(110) wafers than that today, the influence of wet cleaning processes on microroughness of Si(110) surfaces must be clarified. Atomically resolved STM observations are performed after HF-containing solution, and subsequent rinsing with water. The atomic arrangements change drastically by moderate rinsing with water.
STM image of hydrogen-terminated Si(110) after dipping into dilute HF-containing solution (34x34 nm2). STM image of Si(110) surface after subsequent rinsing 7x7 nm2. Characteristic features such as zigzag chains inside a terrace, a single row at step edges and an isolated zigzag row on a terrace are observed. See Appl. Phys. Lett. vol. 85, pp. 6254 (2004).
Visible light irradiation effects on STM/STS observations of intrinsic hydrogenated amorphous silicon surfaces
Intrinsic hydrogenated amorphous Si (a-Si:H) is widely used in the active layer for solar cells. It has been predicted that surface topographies reflect growth processes. Hence the surface structure of a-Si:H must be investigated on the nanometer scale. External light during STM observations enables us to obtain highly resolved images because of photoexcited minority carriers leading to the appearance of a higher voltage across the vacuum than that in the dark. We have found that the increment of the tunneling current is different at each surface site. This indicates that visible light irradiation onto intrinsic a-Si:H surfaces during STM/STS measurements can be helpful to extract either the local electronic or structural information of a-Si:H.
A highly-resolved STM image of a-Si:H surface under visible light irradiation(34x34 nm2). See Surf. Sci. vol. 572, pp. 449 (2004). A result of STM/STS observations. (a) A topographic image of 33x33 nm2 area. (b) A current image at dark. (c) A current image under irradiation. The increment of the tunneling current is different at each surface site.
Evaluation of global planarization process of Si wafer revealed by atomically resolved scanning tunneling microscopy
Flattening of material surfaces in an atomic scale in the wide area (um~m !) is desired earnestly in advanced industries and basic science. For example, a commercial Si wafer finished by CMP processes looks quite flat. But the surface is rough microscopically. We predict that such conventional CMP process does not meet the demand for science and technology in the next generation. In our department, there are some groups to develop novel global planarization processes. The flatness of the polished surface must be evaluated in an atomic level in order to control various machining conditions. With scanning probe techniques, we have revealed that the novel planarization process called EEM (Elastic Emission Machining) creates the flattest Si(001) surface in the world without any thermal treatments.
A typical STM image of a commercial Si(001) wafer (100x100 nm2). The measured peak-to-valley height indicates that this image is occupied with about 14 atomic layers. An STM image of Si(001) surface after the novel global planarization process called EEM (100x100 nm2). Detailed analyses show that 95% of this image is occupied with only 3 atomic layers.
Next topics will be coming up soon !






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Last updated on April 22th, 2009
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